Patent Assignment
Reel/Frame 055518/0582
Assignment of Assignor's Interest
Recorded: 2021-03-08
Pages: 6
Assignors
LEE, SANGHYUN
Executed: 2020-11-30
LYU, JUHYUN
Executed: 2020-11-30
KANG, UNBYOUNG
Executed: 2020-11-30
KIM, CHULWOO
Executed: 2020-12-03
LEE, JONGHO
Executed: 2020-12-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package for Improving Package Reliability