Patent Assignment
Reel/Frame 055522/0265
Assignment of Assignor's Interest
Recorded: 2021-03-08
Pages: 5
Assignors
JUNG, SANGHOON
Executed: 2021-02-06
KIM, YOUNG LYONG
Executed: 2021-02-06
HAN, CHEOLSOO
Executed: 2021-02-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same