IP Library › Assignment 055531/0794
Patent Assignment
Reel/Frame 055531/0794

Assignment of Assignor's Interest

Recorded: 2021-03-09 Pages: 7
Assignors
HONT, HEE BUM
Executed: 2021-02-19
SHIN, HEESUNG
Executed: 2021-02-19
LEE, HOJOON
Executed: 2021-02-19
JUNG, YOUNGHUN
Executed: 2021-02-19
HONG, CHANG-MIN
Executed: 2021-02-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Memory Device and Method of Fabricating the Same
Application: 17/194,995 →
Publication: US 2022/0077162
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the First Assignor's Name Previously Recorded at Reel: 055531 Frame: 0794. Assignor(S) Hereby Confirms the Assignment . Jun 9, 2021
From: HONG, HEE BUM; SHIN, HEESUNG; LEE, HOJOON; JUNG, YOUNGHUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 057196/0441 →