Patent Assignment
Reel/Frame 055532/0675
Assignment of Assignor's Interest
Recorded: 2021-03-09
Pages: 4
Assignors
WU, GUO-HUEI
Executed: 2021-03-07
WANG, POCHUN
Executed: 2021-03-08
TSAI, WEI-HSIN
Executed: 2021-03-07
CHEN, CHIH-LIANG
Executed: 2021-03-07
TIEN, LI-CHUN
Executed: 2021-03-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit, System and Method of Forming the Same