Assignment of Assignor's Interest

Recorded: 2021-03-09 Pages: 6

Assignors

LIU, PENG

Executed: 2018-09-19

BERGSTEN, TOMAS

Executed: 2018-09-20

Assignee

SE-164 83, STOCKHOLM, SWEDEN

Covered Property (1)

PCB Structure and Method and Apparatus for Forming the PCB Structure

Patent: 11,477,878 →

Application: 17/274,554 →

Publication: US 2021/0274638