Patent Assignment
Reel/Frame 055540/0484
Assignment of Assignor's Interest
Recorded: 2021-03-09
Pages: 3
Assignors
JUNG, JOO HWAN
Executed: 2021-02-15
CHOI, JAE WOONG
Executed: 2021-02-15
LEE, SEUNG EUN
Executed: 2021-02-15
KIM, YONG HOON
Executed: 2021-02-15
LEE, JIN WON
Executed: 2021-02-15
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Connection Structure Embedded Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 9, 2021
From: JUNG, JOO HWAN; CHOI, JAE WOONG; LEE, SEUNG EUN; KIM, YONG HOON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 055540/0113 →
Corrective Assignment to Correct the to Add the Fifth Inventor Jin Won Lee Previously Recorded on Reel 055540 Frame 0113. Assignor(S) Hereby Confirms the Assignment.
Mar 11, 2021
From: JUNG, JOO HWAN; CHOI, JAE WOONG; LEE, SEUNG EUN; KIM, YONG HOON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 055558/0927 →