Patent Assignment
Reel/Frame 055555/0124
Assignment of Assignor's Interest
Recorded: 2021-03-09
Pages: 23
Assignors
SMITH, JEFFREY
Executed: 2021-02-23
NIIMI, HIROAKI
Executed: 2021-02-23
CHANEMOUGAME, DANIEL
Executed: 2021-02-23
LIEBMANN, LARS
Executed: 2021-02-23
FULFORD, H. JIM
Executed: 2021-02-23
GARDNER, MARK I.
Executed: 2021-02-23
TAPILY, KANDABARA
Executed: 2021-02-23
DEVILLIERS, ANTON J.
Executed: 2021-03-05
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Formation of Low-Temperature and High-Temperature in-Situ Doped Source and Drain Epitaxy Using Selective Heating for Wrap-Around Contact and Vertically Stacked Device Architectures
Application:
17/196,137 →
Publication:
US 2022/0051905