Patent Assignment
Reel/Frame 055562/0737
Assignment of Assignor's Interest
Recorded: 2021-03-11
Pages: 6
Assignors
PARK, SANGOH
Executed: 2021-02-18
LEE, DONGJUN
Executed: 2021-02-19
KIM, KEUNNAM
Executed: 2021-02-26
YANG, SEUNGHUNE
Executed: 2021-02-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Having Landing Pad Patterns and Methods of Manufacturing the Same