Patent Assignment
Reel/Frame 055565/0096
Assignment of Assignor's Interest
Recorded: 2021-03-11
Pages: 5
Assignor
LEE, SANG-WON
Executed: 2021-02-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Substrate, a Semiconductor Device, and a Mold