Patent Assignment
Reel/Frame 055569/0594
Assignment of Assignor's Interest
Recorded: 2021-03-12
Pages: 4
Assignors
HSIEH, WEI-KANG
Executed: 2020-06-30
TSAI, HAO-YI
Executed: 2020-06-30
KUO, TIN-HAO
Executed: 2020-06-30
CHEN, SHIH-WEI
Executed: 2020-06-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof