Patent Assignment
Reel/Frame 055604/0431
Assignment of Assignor's Interest
Recorded: 2021-03-16
Pages: 4
Assignee
PHOENIX PIONEER TECHNOLOGY CO., LTD.
NO. 458-17, XINXING RD., HUKOU TOWNSHIP, HSINCHU COUNTY, 30353, TAIWAN
Covered Property
(1)
Semiconductor Packaging Substrate, Fabrication Method and Packaging Process Thereof