Patent Assignment
Reel/Frame 055611/0437
Assignment of Assignor's Interest
Recorded: 2021-03-16
Pages: 6
Assignors
KANG, MYUNGSAM
Executed: 2021-02-01
KO, YOUNGCHAN
Executed: 2021-02-02
KIM, JEONGSEOK
Executed: 2021-02-01
MUN, KYUNGDON
Executed: 2021-02-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Under-Bump Metal Structure