Patent Assignment
Reel/Frame 055626/0770
Nunc Pro Tunc Assignment
Recorded: 2021-03-17
Pages: 5
Assignors
SUZUKI, KENICHI
Executed: 2020-04-16
SASHIDA, KAZUYUKI
Executed: 2020-04-16
YAMAJI, MIZUE
Executed: 2020-04-16
YOSHIDA, KENICHI
Executed: 2020-04-16
KUNORI, SHINJI
Executed: 2020-04-16
Assignee
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
2-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 1000004, JAPAN
Covered Property
(1)
Semiconductor Component, Assembly and Method for Manufacturing Semiconductor Component