Patent Assignment
Reel/Frame 055630/0824
Assignment of Assignor's Interest
Recorded: 2021-03-17
Pages: 4
Assignors
CHEN, MING-FA
Executed: 2020-06-19
CHEN, HSIEN-WEI
Executed: 2020-06-19
YEH, SUNG-FENG
Executed: 2020-06-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method of Manufacturing the Same