Patent Assignment
Reel/Frame 055669/0566
Assignment of Assignor's Interest
Recorded: 2021-03-22
Pages: 6
Assignors
KO, YEONGKWON
Executed: 2021-02-15
KANG, UN-BYOUNG
Executed: 2021-02-15
YOO, JAEKYUNG
Executed: 2021-02-15
LEE, TEAK HOON
Executed: 2021-02-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package