Patent Assignment
Reel/Frame 055672/0713
Assignment of Assignor's Interest
Recorded: 2021-03-22
Pages: 7
Assignors
KAMIMURA, DAIGI
Executed: 2018-12-03
TANIYAMA, TOMOSHI
Executed: 2018-12-03
NOGAMI, TAKASHI
Executed: 2018-12-03
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA, TOKYO, 1010045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device