Patent Assignment
Reel/Frame 055679/0950
Assignment of Assignor's Interest
Recorded: 2021-03-23
Pages: 4
Assignors
SHIH, HUNG-LING
Executed: 2021-02-17
WU, WEI CHUANG
Executed: 2021-03-17
YANG, SHIH KUANG
Executed: 2021-03-02
LIN, HSING-CHIH
Executed: 2021-02-17
LIU, JEN-CHENG
Executed: 2021-03-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Through-Substrate-Via with Reentrant Profile