Patent Assignment
Reel/Frame 055682/0009
Assignment of Assignor's Interest
Recorded: 2021-03-23
Pages: 4
Assignors
TENG, LI-FENG
Executed: 2021-03-14
WU, WEI-CHENG
Executed: 2021-03-04
CHUANG, HARRY-HAK-LAY
Executed: 2021-03-04
LIU, LI-JUNG
Executed: 2021-03-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Forming the Same