Patent Assignment
Reel/Frame 055689/0119
Assignment of Assignor's Interest
Recorded: 2021-03-23
Pages: 7
Assignors
JO, GWANGHEE
Executed: 2021-02-23
MOON, DONGJOO
Executed: 2021-02-03
WOO, SIWOONG
Executed: 2021-02-23
KIM, SUNJUNG
Executed: 2021-02-23
SHIM, DONGGIL
Executed: 2021-02-23
KIM, HUIJAE
Executed: 2021-02-23
SEOK, SEUNGDAE
Executed: 2021-02-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Substrate Alignment Device and a Semiconductor Substrate Bonding System Using the Same