Patent Assignment
Reel/Frame 055689/0821
Assignment of Assignor's Interest
Recorded: 2021-03-23
Pages: 7
Assignors
HWANG, HYUNSU
Executed: 2021-02-03
KWEON, JUNYUN
Executed: 2021-02-03
PARK, JUMYONG
Executed: 2021-02-03
OH, DONGJOON
Executed: 2021-02-03
LEE, CHUNGSUN
Executed: 2021-02-03
CHOI, JU-IL
Executed: 2021-02-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Fine Redistribution Patterns
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.