Patent Assignment
Reel/Frame 055697/0074
Assignment of Assignor's Interest
Recorded: 2021-03-24
Pages: 6
Assignors
OH, SUNG LAE
Executed: 2021-03-11
PARK, SANG WOO
Executed: 2021-03-11
CHAE, DONG HYUK
Executed: 2021-03-17
KIM, KI SOO
Executed: 2021-03-11
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, GYEONGGI-DO, ICHEON-SI, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Memory Device Having Logic Circuit Distributed Across Two Peripheral Wafer