Patent Assignment
Reel/Frame 055702/0649
Assignment of Assignor's Interest
Recorded: 2021-03-24
Pages: 4
Assignors
CHEN, WEI-YU
Executed: 2020-10-30
YU, CHI-YANG
Executed: 2020-10-30
HO, KUAN-LIN
Executed: 2020-10-30
CHEN, CHIN-LIANG
Executed: 2020-11-12
LIANG, YU-MIN
Executed: 2020-11-10
WU, JIUN YI
Executed: 2020-11-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Die Corner Removal for Underfill Crack Suppression in Semiconductor Die Packaging