Patent Assignment
Reel/Frame 055703/0153
Assignment of Assignor's Interest
Recorded: 2021-03-24
Pages: 5
Assignors
PAN, KUO LUNG
Executed: 2020-11-25
LAI, YU-CHIA
Executed: 2020-11-25
KUO, TIN-HAO
Executed: 2020-11-25
TSAI, HAO-YI
Executed: 2020-11-25
LIU, CHUNG-SHI
Executed: 2020-11-27
YU, CHEN-HUA
Executed: 2020-11-27
TENG, PO-YUAN
Executed: 2020-11-25
LO, TENG-YUAN
Executed: 2020-11-27
CHANG, MAO-YEN
Executed: 2020-11-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Chip Package Structure Including a Silicon Substrate Interposer and Methods for Forming the Same