Patent Assignment
Reel/Frame 055703/0442
Assignment of Assignor's Interest
Recorded: 2021-03-24
Pages: 4
Assignors
LI, SHU-WEI
Executed: 2020-09-24
LUO, GUANYU
Executed: 2020-09-29
LEE, MING-HAN
Executed: 2020-09-24
YANG, SHIN-YI
Executed: 2020-09-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Graded Metallic Liner for Metal Interconnect Structures and Methods for Forming the Same