Patent Assignment
Reel/Frame 055710/0628
Assignment of Assignor's Interest
Recorded: 2021-03-25
Pages: 6
Assignors
KIM, BYUNGWOOK
Executed: 2021-03-04
KANG, AHRAM
Executed: 2021-03-04
JEONG, SEONGWON
Executed: 2021-03-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Semiconductor Package