Patent Assignment
Reel/Frame 055718/0030
Assignment of Assignor's Interest
Recorded: 2021-03-25
Pages: 7
Assignors
OKUZONO, TAKAHISA
Executed: 2020-12-02
TOMITA, MASAKI
Executed: 2020-12-02
FUJIKATA, JUMPEI
Executed: 2020-12-02
TAKAYANAGI, HIDEKI
Executed: 2020-12-04
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OTA-KU, TOKYO, 144-8510, JAPAN
Covered Property
(1)
Device for Measuring Bump Height, Apparatus for Processing Substrate, Method of Measuring Bump Height, and Storage Medium