Patent Assignment
Reel/Frame 055718/0632
Assignment of Assignor's Interest
Recorded: 2021-03-25
Pages: 6
Assignors
KOH, KYONG HWAN
Executed: 2021-02-26
KIM, JONGWAN
Executed: 2021-02-26
OH, JUHYEON
Executed: 2021-02-26
LEE, YONGKWAN
Executed: 2021-02-26
Assignee
SAMSUNG ELECTRONICS CO, LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Plurality of Recesses and Molding Member with Plurality of Protrusions That Fill the Recesses