Patent Assignment
Reel/Frame 055748/0837
Assignment of Assignor's Interest
Recorded: 2021-03-29
Pages: 4
Assignor
KIM, YONGHO
Executed: 2021-03-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO,, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Trilayer Bonding Bump Structure for Semiconductor Package