Patent Assignment
Reel/Frame 055754/0146
Assignment of Assignor's Interest
Recorded: 2021-03-29
Pages: 7
Assignors
PARK, KWANGWUK
Executed: 2021-02-22
LEE, YOUNGMIN
Executed: 2021-02-22
CHO, SUNGDONG
Executed: 2021-03-04
KIM, EUNJI
Executed: 2021-03-04
MUN, HYOUNGYOL
Executed: 2021-02-25
JEONG, SEOKHWAN
Executed: 2021-02-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Through via Electrode and Device Isolation Structure Including Oxide Layer Pattern and Nitride Layer Pattern Sequentially Stacked on Inner Surface of Trench