Patent Assignment
Reel/Frame 055775/0150
Assignment of Assignor's Interest
Recorded: 2021-03-30
Pages: 5
Assignors
TSENG, HUA-WEI
Executed: 2021-03-02
LIN, YUEH-TING
Executed: 2021-03-01
CHEN, SHAO-YUN
Executed: 2021-03-02
HUANG, LI-HSIEN
Executed: 2021-03-02
SU, AN-JHIH
Executed: 2021-03-01
YEH, MING-SHIH
Executed: 2021-03-01
YEH, DER-CHYANG
Executed: 2021-03-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Including Ipd and Method of Forming the Same