Patent Assignment
Reel/Frame 055775/0208
Assignment of Assignor's Interest
Recorded: 2021-03-30
Pages: 7
Assignors
CHU, LI-HUAN
Executed: 2019-10-15
CHEN, HSU-HSIEN
Executed: 2019-10-09
LIN, LIANG-CHEN
Executed: 2019-10-09
HSIEH, TSUNG-YANG
Executed: 2019-10-16
LEE, HSIN-HSIEN
Executed: 2019-10-09
TSAI, KUEN-HONG
Executed: 2021-03-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Process Thereof