Patent Assignment
Reel/Frame 055775/0771
Assignment of Assignor's Interest
Recorded: 2021-03-31
Pages: 6
Assignors
CHEN, JIUN-TING
Executed: 2020-06-11
WU, CHIH-WEI
Executed: 2020-06-12
LU, SZU-WEI
Executed: 2020-06-12
TSAI, TSUNG-FU
Executed: 2020-06-12
SHIH, YING-CHING
Executed: 2020-06-12
YEH, TING-YU
Executed: 2020-06-17
TSAI, CHEN-HSUAN
Executed: 2020-06-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof