Patent Assignment
Reel/Frame 055777/0786
Assignment of Assignor's Interest
Recorded: 2021-03-31
Pages: 6
Assignors
TSAI, TZU-CHUNG
Executed: 2021-03-28
KO, PING-CHENG
Executed: 2019-06-11
LIU, FANG-YU
Executed: 2019-06-11
YANG, JHIH-YUAN
Executed: 2019-06-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Die Carrier Structure