Patent Assignment
Reel/Frame 055778/0398
Assignment of Assignor's Interest
Recorded: 2021-03-31
Pages: 3
Assignors
CHUNG, CHENG-TING
Executed: 2020-10-12
LIAO, YI-BO
Executed: 2020-10-12
CHENG, KUAN-LUN
Executed: 2020-10-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure with Backside Contact