Patent Assignment
Reel/Frame 055789/0153
Assignment of Assignor's Interest
Recorded: 2021-03-31
Pages: 3
Assignors
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2021-03-26
DELACRUZ, JAVIER A.
Executed: 2021-03-30
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Selective Alteration of Interconnect Pads for Direct Bonding
Application:
17/168,034 →
Publication:
US 2021/0242152
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name
Feb 23, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 066665/0814 →