IP Library › Assignment 066665/0814
Patent Assignment
Reel/Frame 066665/0814

Change of Name

Recorded: 2024-02-23 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (2)
Selective Alteration of Interconnect Pads for Direct Bonding
Application: 17/168,034 →
Publication: US 2021/0242152
Seal for Microelectronic Assembly
Application: 17/806,253 →
Publication: US 2022/0415734
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 31, 2021
From: FOUNTAIN, GAIUS GILLMAN, JR.; DELACRUZ, JAVIER A.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 055789/0153 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Security Interest May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Assignment of Assignor's Interest Feb 23, 2024
From: KATKAR, RAJESH; WANG, LIANG; UZOH, CYPRIAN EMEKA; HUANG, SHAOWU
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 066544/0219 →