IP Library Assignment 055789/0669
Patent Assignment
Reel/Frame 055789/0669

Assignment of Assignor's Interest

Recorded: 2021-03-31 Pages: 3
Assignors
WILLIAMSON, JAIMAL M
Executed: 2021-03-31
NGUYEN, HIEP XUAN
Executed: 2021-03-29
Assignee
TEXAS INSTRUMENTS INCORPORATED
12500 TI BOULEVARD, M/S 3999, DALLAS, TEXAS, 75243
Covered Property (1)
Enhanced Mold Compound Thermal Conductivity
Application: 17/219,681 →
Publication: US 2022/0122936