Patent Assignment
Reel/Frame 055798/0080
Assignment of Assignor's Interest
Recorded: 2021-04-01
Pages: 6
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Processing Substrate, Substrate Processing Apparatus, Recording Medium, Method of Manufacturing Semiconductor Device