Patent Assignment
Reel/Frame 055798/0597
Assignment of Assignor's Interest
Recorded: 2021-04-01
Pages: 4
Assignors
LII, MIRNG JI
Executed: 2021-03-30
CHEN, CHEN-SHIEN
Executed: 2021-03-30
MAO, LUNG-KAI
Executed: 2021-03-30
CHENG, MING-DA
Executed: 2021-03-30
LU, WEN-HSIUNG
Executed: 2021-03-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Heterogeneous Bonding Structure and Method Forming Same