IP Library › Assignment 055808/0001
Patent Assignment
Reel/Frame 055808/0001

Assignment of Assignor's Interest

Recorded: 2021-04-01 Pages: 66
Assignors
KAMIMURA, DAIGI
Executed: 2021-03-22
TANIYAMA, TOMOSHI
Executed: 2021-03-23
SHIRAKO, KENJI
Executed: 2021-03-22
SHIMADA, HIRONARI
Executed: 2021-03-22
HORII, AKIRA
Executed: 2021-03-22
NAKADA, TAKAYUKI
Executed: 2021-03-22
YAMASHITA, NORIHIRO
Executed: 2021-03-26
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property (1)
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Application: 17/211,951 →
Publication: US 2021/0305067
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Spelling of the Names of Assignors Four (4) and Seven (7) Previously Recorded on Reel 055808 Frame 0001. Assignor(S) Hereby Confirms the Assignment of Assignor(S) Interest. Apr 9, 2021
From: KAMIMURA, DAIGI; TANIYAMA, TOMOSHI; SHIRAKO, KENJI; SHIMADA, HIRONORI
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 055884/0001 →