Patent Assignment
Reel/Frame 055813/0761
Assignment of Assignor's Interest
Recorded: 2021-04-02
Pages: 3
Assignors
CHEN, JUN-YAO
Executed: 2021-01-19
HUANG, SHENG-HUANG
Executed: 2021-01-19
WANG, HUNG-CHO
Executed: 2021-01-19
CHUANG, HARRY-HAK-LAY
Executed: 2021-01-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Memory Device and Fabrication Method Thereof