Patent Assignment
Reel/Frame 055821/0918
Assignment of Assignor's Interest
Recorded: 2021-04-05
Pages: 5
Assignors
HUANG, YI-JYUN
Executed: 2016-05-20
HSIEH, TUNG-HENG
Executed: 2016-05-23
YOUNG, BAO-RU
Executed: 2016-05-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device Suppressing Rounded Shapes of Source/Drain Contact Layers