Patent Assignment
Reel/Frame 055858/0535
Assignment of Assignor's Interest
Recorded: 2021-04-07
Pages: 5
Assignors
LILAK, AARON D.
Executed: 2016-09-26
THEOFANIS, PATRICK
Executed: 2016-09-22
MORROW, PATRICK
Executed: 2016-09-28
MEHANDRU, RISHABH
Executed: 2016-09-26
CEA, STEPHEN M.
Executed: 2016-09-29
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Vertical Interconnect Methods for Stacked Device Architectures Using Direct Self Assembly with High Operational Parallelization and Improved Scalability