Patent Assignment
Reel/Frame 055874/0300
Assignment of Assignor's Interest
Recorded: 2021-04-08
Pages: 8
Assignors
LIM, HYUNSEOK
Executed: 2021-03-08
CHO, MINHYUK
Executed: 2021-03-04
BYUN, KYUNG-EUN
Executed: 2021-03-06
SHIN, HYEONJIN
Executed: 2021-03-06
YAMAMOTO, KAORU
Executed: 2021-03-13
YOON, JUNGSOO
Executed: 2021-03-06
LEE, SOYOUNG
Executed: 2021-03-04
JEONG, GEUNO
Executed: 2021-03-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wiring Structures, Methods of Forming the Same, and Semiconductor Devices Including the Same