Patent Assignment
Reel/Frame 055878/0976
Assignment of Assignor's Interest
Recorded: 2021-04-09
Pages: 5
Assignors
HUANG, KUAN-YU
Executed: 2021-04-05
HUANG, SUNG-HUI
Executed: 2021-04-05
HOU, SHANG-YUN
Executed: 2021-04-08
HSU, SHU CHIA
Executed: 2021-04-06
HUANG, YU-YUN
Executed: 2021-04-05
CHANG, WEN-YAO
Executed: 2021-04-05
CHENG, YU-JEN
Executed: 2021-04-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Die Package and Method of Manufacture