Patent Assignment
Reel/Frame 055890/0393
Assignment of Assignor's Interest
Recorded: 2021-04-12
Pages: 6
Assignors
YANG, TAI-I
Executed: 2019-09-10
LIAO, YU-CHIEH
Executed: 2019-09-06
WU, CHIA-TIEN
Executed: 2019-09-06
CHEN, HSIN-PING
Executed: 2019-09-06
CHEN, HAI-CHING
Executed: 2019-09-06
SHUE, SHAU-LIN
Executed: 2019-09-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Method for Interconnection with Self-Alignment