Patent Assignment
Reel/Frame 055890/0745
Assignment of Assignor's Interest
Recorded: 2021-04-12
Pages: 4
Assignor
ZHAO, MENG
Executed: 2021-04-12
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
NO.18, WEN CHANG RD., ECONOMIC-TECHNOLOGICAL, DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100716, CHINA
Covered Property
(1)
Semiconductor Structure with Inversion Layer Between Stress Layer and Protection Layer and Fabrication Method Thereof