Patent Assignment
Reel/Frame 055891/0417
Assignment of Assignor's Interest
Recorded: 2021-04-12
Pages: 2
Assignors
PENG, SHIH-WEI
Executed: 2019-09-17
TZENG, JIANN-TYNG
Executed: 2019-09-17
LIN, WEI-CHENG
Executed: 2019-09-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSING RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure, Device, and Method