Patent Assignment
Reel/Frame 055905/0243
Assignment of Assignor's Interest
Recorded: 2021-04-13
Pages: 3
Assignors
CHEN, MING-FA
Executed: 2021-04-12
CHENG, CHUAN-AN
Executed: 2021-04-12
YEH, SUNG-FENG
Executed: 2021-04-12
HU, CHIH-CHIA
Executed: 2021-04-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Through-Dielectric Vias for Direct Connection and Method Forming Same