Patent Assignment
Reel/Frame 055906/0247
Assignment of Assignor's Interest
Recorded: 2021-04-13
Pages: 4
Assignors
LIN, MENG-HAN
Executed: 2020-12-29
CHANG, CHIH-YU
Executed: 2021-01-06
CHIA, HAN-JONG
Executed: 2020-12-29
YEONG, SAI-HOOI
Executed: 2020-12-29
LIN, YU-MING
Executed: 2020-12-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
3D Stackable Memory and Methods of Manufacture